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The MegPie is a Patented Radial Megasonic Array designed to apply uniform acoustic energy to a rotating substrate

  • Uniformity Energy Applied to Substrate
  • Easy Integration into Existing Tools
  • Standard and Custom Designs

U.S. Referenced Patents
6,188,162 – High Power Megasonic Transducer
6,222,305 – Chemically Inert Megasonic Transducers
6,431,908 – Method for Spring Contact & Matching Megasonic Transducers
6,549,860 – Method and Apparatus for Tuning a Megasonic Transducers
6,791,242 – Radial Power Megasonic Transducer
6,882,087 – Uniform Energy Megasonic Transducer Using Vessel as Resonator
6,904,921 – Indium or Tin Bonded Megasonic Transducer Systems
6,946,774 – Segmented Uniform Energy Megasonic Transducer
7,141,917 – Wedge Shaped Uniform Energy Megasonics Transducer >2MHz
7,145,286 – Indium or Tin Bonded Transducers >2MHz

Foreign Referenced Patents
162149 – Chemically Inert Megasonic Transducers – Taiwan
200216 – radial Power Megasonic Transducer - Taiwan
200200844-9 – Chemically Inert Megasonic Transducers – Singapore
200402092-1 – Radial Power Megasonic Transducer - Singapore
10-0681071 – Chemically Inert Megasonic Transducers - Korea

Mounted above a rotating substrate, the MegPie provides a uniform field of acoustic energy through a fluid to achieve consistent cleaning without damage.

Product Highlights

Mechanical
  • Easy to integrate & install on customer platforms
  • Wide acoustic tolerance for mechanical run out of substrate.
  • Wide array of materials and coatings available ( Aluminum, 316L SS, Ceramic, Quartz, PFA, PVDF, ETFE, ECTFE and more)
  • Custom configurations available
Process
  • Uniform direct acoustic field for damage-free processing
  • Cleaning and Sonochemical applications
  • Pulsed wave or Continuous wave acoustics
  • Control and interface through ProSys MicroDuo advanced electronics
Acoustic Uniformity and Performance
  • Transducer shape gives uniform power distribution on rotating substrates
  • Power density: Up to 3 watts per square centimeter
  • Reduced acoustic attenuation by trapped gasses
  • More electrically stable than strip or full plate transducers

Specifications

Power Density: 

0.1-3.0 Watts/cm²

 

Frequency Range

400 KHz, 1, 2, or 3 MHz

 

Distance Above Substrate: 

0.020” – 0.140” (0.5-3.5mm)

 

Process Fluid Temperature: 

60º C max

 

Head Material: 

PFA Coated 6061 Aluminum, 316 Stainless Steel

 

Dimensions: 

 

 

200mm Wafer Size

 

300mm Wafer Size

 

Head Height:

0.86” (22mm)

0.86” (22mm)

 

Max Width

2.78” (71mm)

3.80” (97mm)

 

Length:

4.47” (114mm)

6.44” (164mm)

 

Weight:

10 OZ. (283 gm)

21 OZ. (595 gm)

 

RF Power Connection:

15’ (4.6m) Cable, BNC Plug

Mounting: 

M6 Female Thread

 

Purge Supply: 

N2 or CDA Purge, 10LPM Flow, ¼” Compression Fitting

Purge Return: 

¼” FEP Tube, 36” long, RF Power Cable enclosed

 

Control System: 

ProSys MicroDuo

 

 

Copyright 1997-2008 ProSys, Inc. All rights reserved.