
The MegPie is a Patented Radial Megasonic Array designed to apply uniform acoustic energy to a rotating substrate
- Uniformity Energy Applied to Substrate
- Easy Integration into Existing Tools
- Standard and Custom Designs
U.S. Referenced Patents
6,188,162 – High Power Megasonic Transducer
6,222,305 – Chemically Inert Megasonic Transducers
6,431,908 – Method for Spring Contact & Matching Megasonic Transducers
6,549,860 – Method and Apparatus for Tuning a Megasonic Transducers
6,791,242 – Radial Power Megasonic Transducer
6,882,087 – Uniform Energy Megasonic Transducer Using Vessel as Resonator
6,904,921 – Indium or Tin Bonded Megasonic Transducer Systems
6,946,774 – Segmented Uniform Energy Megasonic Transducer
7,141,917 – Wedge Shaped Uniform Energy Megasonics Transducer >2MHz
7,145,286 – Indium or Tin Bonded Transducers >2MHz
Foreign Referenced Patents
162149 – Chemically Inert Megasonic Transducers – Taiwan
200216 – radial Power Megasonic Transducer - Taiwan
200200844-9 – Chemically Inert Megasonic Transducers – Singapore
200402092-1 – Radial Power Megasonic Transducer - Singapore
10-0681071 – Chemically Inert Megasonic Transducers - Korea
Mounted above a rotating substrate, the MegPie provides a uniform field of acoustic energy through a fluid to achieve consistent cleaning without damage.
Mechanical
- Easy to integrate & install on customer platforms
- Wide acoustic tolerance for mechanical run out of substrate.
- Wide array of materials and coatings available ( Aluminum, 316L SS, Ceramic, Quartz, PFA, PVDF, ETFE, ECTFE and more)
- Custom configurations available
Process
- Uniform direct acoustic field for damage-free processing
- Cleaning and Sonochemical applications
- Pulsed wave or Continuous wave acoustics
- Control and interface through ProSys MicroDuo advanced electronics
Acoustic Uniformity and Performance
- Transducer shape gives uniform power distribution on rotating substrates
- Power density: Up to 3 watts per square centimeter
- Reduced acoustic attenuation by trapped gasses
- More electrically stable than strip or full plate transducers
Power Density: |
0.1-3.0 Watts/cm² |
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Frequency Range: |
400 KHz, 1, 2, or 3 MHz |
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Distance Above Substrate: |
0.020” – 0.140” (0.5-3.5mm) |
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Process Fluid Temperature: |
60º C max |
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Head Material: |
PFA Coated 6061 Aluminum, 316 Stainless Steel |
Dimensions: |
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200mm Wafer Size |
300mm Wafer Size |
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Head Height: |
0.86” (22mm) |
0.86” (22mm) |
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Max Width |
2.78” (71mm) |
3.80” (97mm) |
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Length: |
4.47” (114mm) |
6.44” (164mm) |
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Weight: |
10 OZ. (283 gm) |
21 OZ. (595 gm) |
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RF Power Connection: |
15’ (4.6m) Cable, BNC Plug |
Mounting: |
M6 Female Thread |
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Purge Supply: |
N2 or CDA Purge, 10LPM Flow, ¼” Compression Fitting |
Purge Return: |
¼” FEP Tube, 36” long, RF Power Cable enclosed |
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Control System: |
ProSys MicroDuo |
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