For Release July 14, 2003

CONTACT: Janet Basler
Product Systems Inc.
408-871-2500 (Voice)
408-871-2504 (Fax)
sales@prosysmeg.com


PROSYS SHIPS PRODUCTION VERSIONS OF MEGPIE™ SINGLE WAFER MEGASONIC TRANSDUCER.

The ProSys MegPie Single Wafer acoustic transducer has achieved 98% removal of sub 100nm particles in less than 60 seconds at low powers.

San Francisco, CA July 14, 2003 - ProSys Inc., the leader in advancing Megasonic transducer technology and products, today unveiled the ProSys MegPie Transducer, an innovative single wafer transducer for applying acoustic energy to a horizontally rotating substrate. This patent pending technology enables a user to apply the acoustic energy directly, perpendicularly, to the surface, thereby concentrating the acoustic Cavitation effects between the substrate and transducer.

The concentrated acoustic energy assists the sono-chemistry reactions that remove particles by applying a uniform field of energy. The uniform field of energy is a direct result of the innovative "Pie" shape of the transducer.

"Our goal was to design a transducer that would provide a uniform field of acoustic energy to a rotating substrate in package that could integrate into any OEM's tool and be adapted to tools in the field" said Mark Beck, founder and CEO of ProSys. "This transducer is a cost effective alternative that will enable Megasonics to be adapted to almost any spinning wafer."

The MegPie achieves radial power uniformity from center to edge with a variable watt density of 0 – 3 Watts/cm2. The transducer is HF compatible and can be purchased in standard sizes for cleaning 100mm to 300mm substrates.

The MegPie can be retrofitted to a variety of standard processing tools in hours.

The MegPie transducer is operated with the recently introduced 2003 CE certified MicroDuo electronics package.