Advanced Process Control in Megasonic-Enhanced Pre-Bonding Cleaning

by D. Dussault, F. Fournel, and V. Dragoi (PDF/616kb)

Direct vs. Indirect Megasonic Tank Cleaning Systems; Uniformity, Cleaning Efficiency and Cost of Ownership

by J. Desagher, D. Dussault, M. Beck, R. Lillard, E. Liebscher (PDF/528kb)

Acoustic Energy: A New Tool for MEMS Manufacturing

by D. Dussault and V. Dragoi (PDF/11.8MB)

Aligned Fusion Wafer Bonding for CMOS-MEMS and 3D Wafer-level Integration Applications

by V. Dragoi, G. Mittendorfer, C. Flötgen, D. Dussault and T. Wagenleitner (PDF/1.2MB)
Damage-Free Cleaning of Sub-50 nm Devices Using Directed Megasonics Technology in a Single Wafer Processor (PDF/335kb)

by J. J. Rosato, M. R. Yalamanchili, M. J. Beck, R. Y. Lillard

Control of Sonoluminescence Signal in Deionized Water Using Carbon Dioxide (PDF/727kb)

by S.Kumari, M.Keswani, S.Singh, M.Beck, E.Liebscher, P.Deymier, S.Raghavan

High Efficiency Single Wafer Cleaning for Wafer Bonding-based 3D Integration Applications (PDF/468kb)

by D. Dussault, F. Fournel and V. Dragoi

Fabrication of High Aspect Ratio SU-8 Structures Using UV Lithography and Megasonic-Enhanced Development (PDF/989kb)

by D. Figura and J. Bartel

Novel Photolithography Yield-Enhancement Technique: Megasonic-Enhanced Development (PDF/627kb)

by V. Dragoi, J. Bartel, and D. Dussault

Innovative Megasonic Cleaning Technology Evaluated Through Direct Wafer Bonding. (PDF/4.55MB)

by F. Fournel, L.Bally, D. Dussault, and V. Dragoi

Acoustic Energy: a New Tool for MEMS Manufacturing (PDF/11MB)

by D. Dussault and V. Dragoi

Control of Sonoluminescence in Carbon Dioxide Containing DI Water at Near Neutral pH Conditions (PDF/473kb)

by Sangita Kumari, Manish Keswani, Satish Kumar Singh, Mark Beck, Eric Leibscher, Pierre Deymier and Srini Raghavan

Megasonic Metrology for Enhanced Process Development (PDF/628kb)

by S. Kumari, M. Keswani, M. Beck, E. Liebscher, T. Liang, P. Deymier, and S. Raghavan

Improving Megasonic Exposure Uniformity for EUV Mask Substrate Cleaning (PDF/1.16MB)

by Matthew House, Abbas Rastegar, Don Dussault, Eric Liebscher

Effect of Dissolved CO2 in De-ionized Water in Reducing Wafer Damage During Megasonic Cleaning in MegPie® (PDF/1.91MB)

by S. Kumari, M. Keswani, S. Singh, M. Beck, E. Liebscher, L. Q. Toan and S. Raghavan

SU-8 Intermediate Layers Wafer Bonding for Microfluidic Devices Fabrication (PDF/68kb)

by V. Dragoi, G. Mittendorfer, C. Thanner, D. Dussault and M. Wimplinger